A component of the Conference Education at:

HBA Health & Beauty America
September 12-14, 2006 (Tuesday - Thursday)
Jacob K. Javits Convention Center
655 West 34th Street (corner of 11th Avenue)
New York, NY 10001

Go beyond conventional design and add 'intelligence' to your packaging and design – electronic and electrical features that add functionality for merchandising, consumer interaction, brand quality and security – and more. Implementing these advanced technologies is being used in medical, pharmaceutical and other industries to improve product security and brand authentication.

This special program offers an overview of emerging technologies like RFID, EPC (Electronic Product Code), Holograms, 2D Bar codes and sensors that promise unprecedented opportunities to change the nature of packaging, labels and materials management.

This session features short presentations and interactive roundtable discussions that answer questions such as: What is Smart Packaing? How can you determine the value of smart packaging? How are smart packaging technologies integrated into production? And more. If you want to see what packaging will look like in the near future – especially for a youth market immersed in consumer electronics and mobile communications – attend the Smart Packaging special program.

WHO SHOULD ATTEND:
Package Design, Package Development, Marketing, Entrepreneurs, New Product Development (Marketing and Technical), Top Management, Display Directors, Display Design, Sales, International Executives

PRODUCED BY:
This Conference is produced by CMP Media, producers of RFID World Conference and Exhibition. More information is available at www.rfid-world.com

HOSTED BY:
Smart Packaging Conference at HBA is hosted and co-produced by RFID Product News Magazine. More information is available at www.lyonsmediainc.com